Thermal Management  Services of SAMEER-CEM

Thermal Design Analysis

SAMEER-CEM has the state of art CFD and FEM CAD tools.
To model, analyse and optimise thermal design at various levels of electronics packaging namely-

  • Enclosure Level,  Rack/ Subrack Level , Board Level,  Component level
  • Thermal design and analysis is applicable to all types of electronic equipment, working in various operating environments. Cost-effective design solution are evolved  for optimum cooling performance.
  • Thermal Measurement

The centre is equipped with ;

  • "Airflow simulation Chamber" for evaluation of airvents Heatsinks and PCBs
  • "Infrared Imaging system" for non contact measurements
  • "Data Logger & Calibrated instrumentation" for air velocity, pressure and temperature measurement