Thermal Management Services of SAMEER-CEM
Thermal Design Analysis
SAMEER-CEM has the state of art CFD and FEM CAD tools.
To model, analyse and optimise thermal design at various levels of electronics packaging namely-
- Enclosure Level, Rack/ Subrack Level , Board Level, Component level
- Thermal design and analysis is applicable to all types of electronic equipment, working in various operating environments. Cost-effective design solution are evolved for optimum cooling performance.
- Thermal Measurement
The centre is equipped with ;
- "Airflow simulation Chamber" for evaluation of airvents Heatsinks and PCBs
- "Infrared Imaging system" for non contact measurements
- "Data Logger & Calibrated instrumentation" for air velocity, pressure and temperature measurement